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AIM V9 SAC305 T4 No Clean Lead Free Solder Paste (10 jars) Select Size:500-Gram Jar DS360 is light and easy

SKU: 10502339649

4.5
USD561.63 USD607.63

Pay in 4 interest-free payments of $140.41 Learn more

Shipping Estimate
USA
  • USA
  • CAN

Ships within 48 hours · Estimated delivery Aug 11 - Aug 16

Description

DS360 is light and easy to clean and maintain

Supplied with lift stand

Torque Cover for Mini BF-Series and EF-Series

Smear- resistant on glass

AIM V9 SAC305 T4 No Clean Lead Free Solder Paste (10 jars) Select Size:500-Gram Jar DS360 is light and easyAre you looking to eliminate voids? New AIM V9 No Clean solder paste is formulated for near zero voiding on BGA, BTC and LED soldering applications. Significant void reduction achievable on all surface finishes including ENIG, ImSn and OSP. V9 exhibits stable print performance on fine feature devices over 12 hours. V9 post process residue is easily pin probed and has high SIR values. Low Voiding: as low as 1% on BGA and <5% on BTCs Capable of

Exchange/Return Notes
  • We offer a 30-day return/exchange service after receiving.
  • Final sale items are not eligible for returns or exchanges.
  • To process your return/exchange, please contact us at [email protected]
  • Please click here for more details>>> Return & Exchange Policy

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