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Compact module footprint with isolated baseplate for straightforward heatsink mounting
Quick Reference: 1MBI400NN-120
Dual (2-in-1) module configuration simplifies half-bridge leg construction in inverter and converter topologies
reducing external component count and improving switching transitions
CM300DU-24F-MITSUBISHI Desc Compact module footprint with isolatedThe Mitsubishi CM300DU 24F is a high performance dual IGBT module engineered for high current, high voltage industrial power electronics. Rated at 300 amperes and 1200 volts, this module incorporates Mitsubishi's advanced IGBT technology with co packaged fast recovery freewheeling diodes, delivering low switching losses and excellent thermal performance. Its robust construction and reliable gate characteristics make it a preferred choice for designers
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