Hypertec 16GB PC3-10600R (Legacy) memory module 1 x 16 GB DDR3 1333 MHz DDR2 Memory Buffered memory type Unregistered

Memory Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 2 GB Internal memory 2 GB Memory form factor 204-pin SO-DIMM ECC No Memory clock speed 1333 MHz Internal memory type DDR3 Features Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 2 GB Internal memory 2 GB Memory form factor 204-pin SO-DIMM ECC No Memory clock speed 1333 MHz Internal memory type DDR3

Memory Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 2 GB Internal memory 2 GB Component for PC/server Memory form factor 240-pin DIMM Memory channels Single-channel ECC Yes Memory clock speed 1600 MHz Internal memory type DDR3 Features Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 2 GB Internal memory 2 GB Component for PC/server Memory form factor 240-pin DIMM Memory channels Single-channel ECC Yes Memory clock speed 1600 MHz Internal memory type DDR3

Memory Buffered memory type Registered (buffered) Memory layout (modules x size) 1 x 8 GB Internal memory 8 GB Memory form factor 240-pin DIMM Memory ranking 1 ECC Yes Memory clock speed 1600 MHz Internal memory type DDR3 Features Buffered memory type Registered (buffered) Memory layout (modules x size) 1 x 8 GB Internal memory 8 GB Memory form factor 240-pin DIMM Memory ranking 1 ECC Yes Memory clock speed 1600 MHz Internal memory type DDR3

DVD Duplication Units to Ergonomic Workstation Equipment

Hypertec 16GB PC3-10600R (Legacy) memory module 1 x 16 GB DDR3 1333 MHz DDR2 Memory Buffered memory type UnregisteredA Hypertec Legacy Memory Module is a module that uses no current DRAM technology and is no longer in mainstream production by OEMS and or third party suppliers. Hypertec are committed to providing a full memory upgrade landscape as part of our core product offering and as such, there may be occasions where we need to utilise professionally repurposed components. Any repurposed components are removed within a full ESD environment and then used to