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HeatSink Cooling Thermal Paste (Bottle Packing) TSDC0078 non-curing

SKU: 85377586305

4.0
USD125.00 USD155.00

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USA
  • USA
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Ships within 48 hours · Estimated delivery Aug 17 - Aug 22

Description

non-curing

ISL 6563 CRZ

short circuit of BGA and CPU socket

ISL 62882 CHRTZ

HeatSink Cooling Thermal Paste (Bottle Packing) TSDC0078 non-curingGenerally used as a thermal coupling of electrical electronic devices to heat sinks such as base or mounting studs of transistors, diodes and rectifiers Generally used as a thermal coupling of electrical electronic devices to heat sinks such as base or mounting studs of transistors, diodes and rectifiers. It is used for maintaining a positive heat sink seal that improves heat transfer from the electrical electronic component device to the heat sink or

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